UK-headquartered ARM and the IBM-led Common Platform Alliance have formed a multi-year partnership to develop 32nm and 28nm SoC (System-on-Chip) design platform leveraging ARM's optimized power-efficient cores and libraries and the alliance's HKMG (High-K Metal Gate) technology in 32nm and 28nm processes, according to a press release by IBM. Via the partnership ARM expects to develop customized physical IP (Intellectual Properties) - including logic, memory, and interface products - as well as a design platform thereof for the IBM-led alliance.

The Common Platform Alliance consists of IBM, Chartered Semiconductor Manufacturing, and Samsung Electronics. The alliance expects to further its collaborative cause and enlist more members in the near future. Earlier in September, IBM entered into another 32nm process project, whereby the company and other R&D partners - including NEC Electronics, Freescale, Infineon Technologies, STMicroelectronics, and Toshiba - will jointly develop next-generation core CMOS (Complementary Metal-Oxide Semiconductor) process technology at the 32nm node.